Can a carrier-grade base station deliver a high-performance 5G infrastructure?

This achievement demonstrates that high-performance 5G infrastructure no longer requires bulky, power-hungry servers. Instead, SolidRun and Amarisoft have proven that a carrier-grade base station can now be delivered in a compact, power-efficient system without compromising on features or performance.

What are some examples of PCB-embedded power packages?

Many examples of PCB-embedded power packages are disclosed in the scientific literature. These demonstrators include all common types of power semiconductors with nominal blocking voltages up to 1200 V. A key benefit of PCB embedding is the planar structure, which enables low-inductive designs.

Do embedded power modules improve load cycling capability?

To highlight the potential of the technology, they show in their publication the highest number of cycles to failure. These values represent an upper boundary in that case. Compared to conventional wire-bonded power modules, all reported results for embedded modules indicate a clear improvement of the load cycling capability.

Are embedded power packages reliable?

Discussion of reliability of embedded power packages. Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size.

What are the benefits of embedding power semiconductor devices into printed circuit boards?

Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection resistances and parasitic inductances.

Why did Fraunhofer IZM develop PCB-embedded 2-chip modules?

In view of a higher degree of miniaturization, Fraunhofer IZM developed PCB-embedded 2-chip modules, 3D System-in-Package (SiP), and Quad-Flat Non-Lead (QFN) packages (Ostmann et al., 2009). The miniaturization came along with a drastic reduction of parasitic resistances and inductances, which is of special interest for power electronic circuits.